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Influence of Carbon Nanotube Concentration on the Interconnection Properties of Solderable Isotropic and Anisotropic Conductive Adhesive
Byung-Seung Yim, Hee Jun Youn, Jeong Il Lee, Jong-Min Kim
J Weld Join. 2020;38(2):152-157.   Published online April 23, 2020
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2032038
Microstructure and Mechanical Properties of Friction-Welded Alloy 718 and SNCRW Stainless Steel After Post-Weld Heat-Treatment
Jeoung Han Kim, Nam-Yong Kim, Yu Sik Kong, Nho Kwang Park
J Weld Join. 2019;37(4):313-317.   Published online August 30, 2019
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Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect
Sunghyun Sohn, Jeonga Kim, Yujin Park, Kyung Mox Cho, Namhyun Kang
J Weld Join. 2019;37(4):363-368.   Published online August 28, 2019
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