Journal of Welding and Joining

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Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes: So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong; J Weld Join. 2023;41(5):387-395. Published online October 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.5.9
Cited By 2; Full text PubReader ePub PDF

Design by Topology Optimization and Performance Test of Ultrasonic Bonding Module for Flip-Chip Packaging: Ji Soo Kim, Jong Min Kim, Soo Il Lee; J Weld Join. 2012;30(6):113-119. Published online December 23, 2012; DOI: https://doi.org/10.5781/KWJS.2012.30.6.113; PDF

A Study on the Optimization of IR Laser Flip-chip Bonding Process Using Taguchi Methods: Chun-Sam Song, Hyun-Sik Ji, Joohan Kim, Jong-Hyeong Kim, Hyo-Sok Ahn; J Weld Join. 2008;26(3):30-36. Published online July 31, 2008; PDF

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

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17,503	Recent Progress of TGV Technology for High Performance Semiconductor Packaging
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Cited By 8	Research Trends in the Directed Energy Deposition Method of Heterogeneous Materials
Cited By 8	Recent Progress of TGV Technology for High Performance Semiconductor Packaging
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Cited By 7	Analyzing the Influence of Welding Process Selection on Residual Stresses in Tube-to-Tubesheet Welded Joints
Cited By 5	Effect of Cr on the Hot Ductility of Austenitic Fe-Mn-Al-C Lightweight Steel

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