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Thermal Conductivity Measurement Method for the Thin Epoxy Adhesive Joint Layer
Da-In Lim, So-Jeong Lee, Seung-Boo Jung, Jun-Ki Kim
J Weld Join. 2021;39(4):402-408.   Published online August 23, 2021
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2032015
Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications
Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
J Weld Join. 2019;37(2):7-14.   Published online April 30, 2019
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2031937
Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate
Kyung-Yeol Kim, Haksan Jeong, Woo-Ram Myung, Seung-Boo Jung
J Weld Join. 2018;36(2):14-20.   Published online April 30, 2018
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2031702
The Effect of Nano Functionalized Block Copolymer Addition on the Joint Strength of Structural Epoxy Adhesive for Car Body Assembly
Hye-rim Lee, So-jeong Lee, Chang-young Lim, Jong-dock Seo, Mok-soon Kim, Jun-ki Kim
J Weld Join. 2015;33(4):44-49.   Published online August 31, 2015
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Epoxy solder paste and its applications
Jong-Tae Moon, Yong-Sung Eom, Jong-Hyun Lee
J Weld Join. 2015;33(3):32-39.   Published online June 30, 2015
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2031538
The Effect of Zirconate Addition on the Joint Properties of Epoxy Adhesive for Car Body Assembly
Eun-taek Jeung, Hye-rim Lee, So-jeong Lee et al.
J Weld Join. 2013;31(5):71-76.   Published online November 5, 2013
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Effect of Curing Agent on the Curing Behavior and Joint Strength of Epoxy Adhesive
Min-Su Kim, Hae-Yeon Kim, Se-Hoon Yoo, Jong-Hoon Kim, Jun-Ki Kim
J Weld Join. 2011;29(4):54-60.   Published online September 12, 2011
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