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- Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes
- So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong
- J Weld Join. 2023;41(5):387-395. Published online October 31, 2023
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- Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
- Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong
- J Weld Join. 2022;40(2):165-174. Published online April 21, 2022
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- Thermal Conductivity Measurement Method for the Thin Epoxy Adhesive Joint Layer
- Da-In Lim, So-Jeong Lee, Seung-Boo Jung, Jun-Ki Kim
- J Weld Join. 2021;39(4):402-408. Published online August 23, 2021
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- Effect of Fine Silica Filler Addition on the CTE and Void Behavior of Non-conductive Paste for CoB Flip Chip Bonding
- Da-Eun Lim, Da-Hoon Jung, So-Jung Lee et al.
- J Weld Join. 2018;36(4):83-88. Published online August 6, 2018
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- Evaluation Method for Snap Cure Behavior of Non-conductive Paste for Flip Chip Bonding
- Kyung-Eun Min, Jun-Sik Lee, So-Jeong Lee, Sung Yi, Jun-Ki Kim
- J Weld Join. 2015;33(5):41-46. Published online October 30, 2015
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- Design by Topology Optimization and Performance Test of Ultrasonic Bonding Module for Flip-Chip Packaging
- Ji Soo Kim, Jong Min Kim, Soo Il Lee
- J Weld Join. 2012;30(6):113-119. Published online December 23, 2012
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- Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
- Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee
- J Weld Join. 2011;29(6):65-70. Published online January 20, 2012
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- A Study on Laser Assisted Machining for Silicon Nitride Ceramics (Ⅲ) - Variation of the Main Cutting Force and Life of Cutting Tool by LAM of SSN and HIPSN
- Jong-Do Kim, Su-Jin Lee, Tae-Young Kang, Jeong Suh, Jae-Hoon Lee
- J Weld Join. 2010;28(6):35-39. Published online January 10, 2011
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- Research of Optimum Reflow Process Condition for 0402 Electric Parts
- Junghwan Bang, Sehyung Lee, Yueseon Shin, Jeonghan Kim, Changwoo Lee
- J Weld Join. 2009;27(1):85-89. Published online March 12, 2009
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- A Study on the Optimization of IR Laser Flip-chip Bonding Process Using Taguchi Methods
- Chun-Sam Song, Hyun-Sik Ji, Joohan Kim, Jong-Hyeong Kim, Hyo-Sok Ahn
- J Weld Join. 2008;26(3):30-36. Published online July 31, 2008
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- Flow Characteristics and Filling Time Estimation for Underfill Process
- Hyung-Sub Sim, Seong-Hyuk Lee, Jong-Min Kim, Young-Eui Shin
- J Weld Join. 2007;25(3):45-50. Published online July 19, 2007
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- Fabrication of Solder Bump Pattern Using Thin Mold
- Dong-Jin Nam, Jae-Hak Lee, Choong-Don Yoo
- J Weld Join. 2007;25(2):76-81. Published online May 17, 2007
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- Fabrication of Through-hole Interconnect in Si Wafer for 3D Package
- Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha et al.
- J Weld Join. 2006;24(2):64-70. Published online July 18, 2006
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