Article type

  • HOME
  • ARTICLE CATEGORY
  • Article type
Effects of High-Power Laser Heat Input on the Mechanical Properties of GPa-Grade Advanced High Strength TRIP Steel
Sangwoo Nam, Hyung Won Lee, Cheolhee Kim, Chul-Young Jung, Yonung-Min KIm
J Weld Join. 2021;39(5):505-512.   Published online October 20, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
Comparative Study of Joint Performance According to Joining Methods Between Al7075-T6 and SPFC590DP for Lightweight Car Body
Keong Hwan Cho, Jin Hyeok Joo, Jung Heum Lee, Je Hoon Oh, Dong Hyuck Kam
J Weld Join. 2021;39(5):497-504.   Published online October 19, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
2032177
Comparative Study on Mechanical Joints of Aluminum Vibration Damping Sheet and 1.5 GPa HPF Steel sheet
Jin Hyeok Joo, Keong Hwan Cho, Je Hoon Oh, Dong Hyuck Kam
J Weld Join. 2021;39(5):489-496.   Published online October 20, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
2032180
Resistance Spot Weldability of Aluminum Alloy with 6 wt.% Magnesium
Mingyu Kim, Sehyeon Kim, Insung Hwang et al.
J Weld Join. 2021;39(5):480-488.   Published online October 27, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
2032179
Weldability Evaluation of GMAW and GTAW for Al-6.7 wt.% Mg Alloy
Taehoon Kang, Jiyoung YU, Young-Min Kim, Insung Hwang, Seung Hwan Lee, Dong-Yoon Kim
J Weld Join. 2021;39(5):471-479.   Published online October 25, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
2032175
Convolutional Neural Network Model for the Prediction of Back-Bead Occurrence in GMA Root Pass Welding of V-groove Butt Joint
Hyung Won Lee, Jiyoung Yu, Gwang-Gook Kim et al.
J Weld Join. 2021;39(5):463-470.   Published online October 19, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
Welding Distortion Prediction for Multi-Seam Welded Pipe Structures using Equivalent Thermal Strain Method
Chunbiao Wu, Chao Wang, Jae-Woong Kim
J Weld Join. 2021;39(4):435-444.   Published online August 30, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
A Study on the Optimization of Welding Conditions for Titanium Drums Using GPS
Won-Bin Oh, Ill-Soo Kim, Tae-Jong Yun et al.
J Weld Join. 2021;39(4):419-426.   Published online August 23, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
Thermal-induced Residual Stresses and Distortions in Friction Stir Welds - A Literature Review
Mohamed H. El-Moayed, Ahmed Y. Shash, Mahmoud Abd Rabou, Mahmoud G. El-Sherbiny
J Weld Join. 2021;39(4):409-418.   Published online August 11, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
Thermal Conductivity Measurement Method for the Thin Epoxy Adhesive Joint Layer
Da-In Lim, So-Jeong Lee, Seung-Boo Jung, Jun-Ki Kim
J Weld Join. 2021;39(4):402-408.   Published online August 23, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
Penetration Depth Modeling and Process Parameter Maps for Laser Welds Using Machine Learning
Bum-su Go, Hyeonjeong You, Hee-seon Bang, Cheolhee Kim
J Weld Join. 2021;39(4):392-401.   Published online August 11, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater
Yun-Chan Kim, Dong-Yurl Yu, Junhyuk Son et al.
J Weld Join. 2021;39(4):384-391.   Published online August 27, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee
J Weld Join. 2021;39(4):376-383.   Published online August 23, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
2032166
Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
J Weld Join. 2021;39(4):368-375.   Published online August 26, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
2032163
Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Mi-Song Kim, Won Sik Hong, Myeongin Kim
J Weld Join. 2021;39(4):359-367.   Published online August 23, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

Register for e-submission  Register for e-submission
Register here to access the e-submission system of Journal of Welding and Joining for authors and reviewers.
Register for e-submission  Manuscript Submission
To submit a manuscript, please visit the Journal of Welding and Joining e-submission management system at https://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of Welding and Joining e-submission system.
For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Register for e-submission  Free archive
Anyone may access any past or current articles without logging in.

ABOUT
BROWSE ARTICLES
ARTICLE CATEGORY 
FOR CONTRIBUTORS
Editorial Office
#304, San-Jeong Building, 23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
Tel: +82-2-538-6511    Fax: +82-2-538-6510    E-mail: koweld@kwjs.or.kr                

Copyright © 2024 by The Korean Welding and Joining Society.

Developed in M2PI