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Young-Ki Ko 4 Articles
2031596
Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2014;32(3):282-287.   Published online June 30, 2014
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2031590
Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2014;32(3):233-240.   Published online June 30, 2014
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High Speed TSV Filling Technology by using Molten Solder and Fabrication of Composite Solder as Filler Material
Young-Ki Ko, Myung-Suk Kang, Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2012;30(3):21-25.   Published online July 18, 2012
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High Speed and Low Cost TSV Filling Technology by Using Molten Solder
Young-Ki Ko, Min-Kuy Han, Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2011;29(3):14-18.   Published online July 7, 2011
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