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Young-Chul Lee 1 Article
Study on Fabrication of 3-Dimensional Stacked Chip Package with Anisotropic Conductive Film
Young-Chul Lee, Jong-Woong Kim, Kwang-Seok Kim, Chong-Hee Yu, Seung-Boo Jung
J Weld Join. 2009;27(3):32-37.   Published online July 6, 2009
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