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Author     
Yong-Ho Ko 11 Articles
Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module
Seungju Baek, Dong-Yurl Yu, Jun-Hyuk Son et al.
J Weld Join. 2020;38(4):366-373.   Published online August 24, 2020
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2032080
A Study on Joint Properties of Sn-Cu-(X)Al-(Y)Si/Cu Solder by Multiple Reflow
Dong-Yurl Yu, Jun-Hyuk Son, Yong-Ho Ko, Chang-Woo Lee, Dongjin Byun, Junghwan Bang
J Weld Join. 2020;38(2):131-137.   Published online April 28, 2020
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A Study on the Electrochemical Corrosion Property of Sn-xSb Solder Alloy
Junhyuk Son, Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang
J Weld Join. 2018;36(3):78-82.   Published online June 19, 2018
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2031939
Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions
Dong-Yurl Yu, Junhyuk Son, Yong-Ho Ko, Chang-Woo Lee, Junghwan Bang
J Weld Join. 2018;36(2):21-27.   Published online April 30, 2018
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Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints
Jeonga Kim, Yujin Park, Chul Min Oh et al.
J Weld Join. 2017;35(3):7-14.   Published online June 30, 2017
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2031687
A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules
Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee
J Weld Join. 2015;33(3):19-24.   Published online June 30, 2015
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2031596
Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2014;32(3):282-287.   Published online June 30, 2014
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2031590
Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2014;32(3):233-240.   Published online June 30, 2014
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2031535
Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module
Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Jeonghan Kim, Chang-Woo Lee
J Weld Join. 2013;31(5):54-58.   Published online November 5, 2013
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2031503
Study on Joint of Micro Solder Bump for Application of Flexible Electronics
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2013;31(3):4-10.   Published online June 30, 2013
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Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2011;29(6):65-70.   Published online January 20, 2012
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