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WonSik Hong 6 Articles
Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
Sujong Kim, Wonsik Hong, Hyunbin Nam, Namhyun Kang
J Weld Join. 2021;39(1):89-102.   Published online February 26, 2021
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Verification Guideline of Pb-free Solder Joint Reliability for Military Electronics
WonSik Hong, Gi-Young Goo, UnHee Hwang
J Weld Join. 2012;30(3):44-50.   Published online July 18, 2012
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Behavior of Vibration Fracture for Sn-Ag-Cu-X Solders by Soldering
Sanghun Jin, Namhyun Kang, Kyung-mox Cho, Changwoo Lee, Wonsik Hong
J Weld Join. 2012;30(2):65-69.   Published online May 16, 2012
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Relaibility Validation Methodology for Implementation Pb-free Solder to Military Electronics
Jaesseong Jeong, Chulmin Oh, Gi-Young Goo, Young-Ho Yoon, UnHee Hwang, WonSik Hong
J Weld Join. 2011;29(4):11-20.   Published online September 12, 2011
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The Growth Mechanism and Mitigation Method of Sn Whiskers
Chulmin Oh, JaeSung Jung, ki-Young Ku, Young-Ho Yoon, UnHee Hwang, WonSik Hong
J Weld Join. 2011;29(4):3-10.   Published online September 12, 2011
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PoF Based Accelerated Life Prediction with 3 Dimensional Packaging Technology Development
WonSik Hong, Chul-Min Oh
J Weld Join. 2009;27(3):10-16.   Published online July 6, 2009
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