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Won-Sik Hong 3 Articles
Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints
Won-Sik Hong, Whee-Sung Kim, Noh-Chang Park, Kwang-Bae Kim
J Weld Join. 2007;25(2):82-88.   Published online May 17, 2007
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Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement
Won-Sik Hong, Chul-Min Oh, Noh-Chang Park, Byung-Suk Song, Seung-Boo Jung
J Weld Join. 2007;25(2):16-23.   Published online May 17, 2007
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Analysis Method of Metallic Ion Migration
Won-Sik Hong, Seung-Boo Jung, Kwang-Bae Kim
J Weld Join. 2005;23(2):32-40.   Published online May 12, 2005
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