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Won-Joong Kim 4 Articles
2031589
TSV Filling Technology using Cu Electrodeposition
Se-Ho Kee, Ji-Oh Shin, Il-Ho Jung, Won-Joong Kim, Jae-Pil Jung
J Weld Join. 2014;32(3):225-232.   Published online June 30, 2014
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2031564
Bonding Mechanism and Strength of Metals to Ceramics
Se-Ho Kee, Jae-Pil Jung, Won-Joong Kim
J Weld Join. 2014;32(1):40-46.   Published online February 27, 2014
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Active Metal Brazing Applied to Joining of ZrO2-Ti Alloy
Se-Ho Kee, Sang-Yoon Park, Jae-Pil Jung, Won-Joong Kim
J Weld Join. 2012;30(3):38-43.   Published online July 18, 2012
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Cu Filling into TSV and non-PR Sn bumping for 3 Dimension Chip Packaging
Sung-Chul Hong, Wang-Gu Lee, Jun-Kyu Park, Won-Joong Kim, Jae-Pil Jung
J Weld Join. 2011;29(1):9-13.   Published online March 4, 2011
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