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Sung-Jun Hong 2 Articles
Formation of Through-Hole and Cu-Filling for 3 Dimensional Packaging Technology
Sung-Jun Hong, Ji-Hun Jun, Jae-Pil Jung
J Weld Join. 2007;25(2):24-30.   Published online May 17, 2007
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3 Dimensional Packaging Technology Using Via
Sung-Jun Hong, Kyoo-Seok Kim, Norman Zhou, Jae-Pil Jung
J Weld Join. 2006;24(2):29-33.   Published online July 18, 2006
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