Author index

  • HOME
  • BROWSE ARTICLES
  • Author index
Author     
Min Jeong Ha 1 Article
2032220
Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
Min Jeong Ha, Ji-Ho Kim, Jae-Goo Han, Jin-Seok Yang, Jong-Min Kim, Byung-Seung Yim
J Weld Join. 2022;40(3):242-247.   Published online June 14, 2022
Full textFull text    PubreaderPubReader    ePubePub    CrossRef-TDMCrossref - TDM    PDFPDF    

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

Register for e-submission  Register for e-submission
Register here to access the e-submission system of Journal of Welding and Joining for authors and reviewers.
Register for e-submission  Manuscript Submission
To submit a manuscript, please visit the Journal of Welding and Joining e-submission management system at https://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of Welding and Joining e-submission system.
For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Register for e-submission  Free archive
Anyone may access any past or current articles without logging in.


ABOUT
BROWSE ARTICLES
ARTICLE CATEGORY 
FOR CONTRIBUTORS
Editorial Office
#304, San-Jeong Building, 23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
Tel: +82-2-538-6511    Fax: +82-2-538-6510    E-mail: koweld@kwjs.or.kr                

Copyright © 2022 by The Korean Welding and Joining Society.

Developed in M2PI