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Jeong Il Lee 4 Articles
Influence of Carbon Nanotube Concentration on the Interconnection Properties of Solderable Isotropic and Anisotropic Conductive Adhesive
Byung-Seung Yim, Hee Jun Youn, Jeong Il Lee, Jong-Min Kim
J Weld Join. 2020;38(2):152-157.   Published online April 23, 2020
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Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
J Weld Join. 2019;37(1):76-81.   Published online January 24, 2019
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2031840
Reliability Properties of Carbon Nanotube-filled Solderable Anisotropic Conductive Adhesives
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
J Weld Join. 2017;35(3):15-20.   Published online June 30, 2017
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