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Ja-Myeong Koo 5 Articles
Reliability Evaluation of Electronic Circuit Printed Using Metallic Ink
Ja-Myeong Koo, Jong-Bum Lee, Sang-Su Ha et al.
J Weld Join. 2008;26(2):37-42.   Published online June 18, 2008
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Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Bo-In Noh, Seung-Boo Jung
J Weld Join. 2008;26(1):37-43.   Published online March 21, 2008
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Ultrasonic Bonding Technology for Flip Chip Packaging
Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon et al.
J Weld Join. 2008;26(1):31-36.   Published online March 21, 2008
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Electrical Characterization of Electronic Package
Jong-Woong Kim, Ja-Myeong Koo, Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
J Weld Join. 2008;26(1):17-23.   Published online March 21, 2008
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Flip-chip Bonding Technology and Reliability of Electronic Packaging
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo et al.
J Weld Join. 2007;25(2):6-15.   Published online May 17, 2007
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