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Hye Min Lee 3 Articles
2032293
Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
Joo Young Bae, Mi-Song Kim, Hye Min Lee et al.
J Weld Join. 2023;41(5):379-386.   Published online October 31, 2023
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2032294
Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes
So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong
J Weld Join. 2023;41(5):387-395.   Published online October 31, 2023
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2032281
Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish
Hye Min Lee, Mi-Song Kim, Won Sik Hong
J Weld Join. 2023;41(4):265-274.   Published online August 31, 2023
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