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Chang-Yong Hyun 2 Articles
Chip Sinter-Bonding Using Ag-Based Paste for Power Semiconductor Devices
Na Yeon Lee, Jong-Hyun Lee, Chang-Yong Hyun
J Weld Join. 2019;37(5):482-492.   Published online October 4, 2019
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TSV Interconnection Technology Using Solder Nanoparticles
Jong-Hyun Lee, Jong-Ho Yoon, Chang-Yong Hyun
J Weld Join. 2011;29(3):27-34.   Published online July 7, 2011
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