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Chang-Woo Lee 23 Articles
Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater
Yun-Chan Kim, Dong-Yurl Yu, Junhyuk Son et al.
J Weld Join. 2021;39(4):384-391.   Published online August 27, 2021
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2032080
A Study on Joint Properties of Sn-Cu-(X)Al-(Y)Si/Cu Solder by Multiple Reflow
Dong-Yurl Yu, Jun-Hyuk Son, Yong-Ho Ko, Chang-Woo Lee, Dongjin Byun, Junghwan Bang
J Weld Join. 2020;38(2):131-137.   Published online April 28, 2020
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2031939
Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions
Dong-Yurl Yu, Junhyuk Son, Yong-Ho Ko, Chang-Woo Lee, Junghwan Bang
J Weld Join. 2018;36(2):21-27.   Published online April 30, 2018
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Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu et al.
J Weld Join. 2017;35(5):38-47.   Published online September 26, 2017
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2031728
Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint
Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee
J Weld Join. 2016;34(1):26-34.   Published online February 29, 2016
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2031687
A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules
Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee
J Weld Join. 2015;33(3):19-24.   Published online June 30, 2015
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2031596
Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2014;32(3):282-287.   Published online June 30, 2014
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2031590
Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2014;32(3):233-240.   Published online June 30, 2014
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2031535
Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module
Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Jeonghan Kim, Chang-Woo Lee
J Weld Join. 2013;31(5):54-58.   Published online November 5, 2013
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Fabrication and Reliability Test of Device Embedded Flexible Module
Dae Gon Kim, Sung Taik Hong, Deok Heung Kim, Won Sik Hong, Chang-Woo Lee
J Weld Join. 2013;31(3):84-88.   Published online June 30, 2013
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2031503
Study on Joint of Micro Solder Bump for Application of Flexible Electronics
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2013;31(3):4-10.   Published online June 30, 2013
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Evaluation of Property and Reliability of Sn3.5Ag and Sn0.7Cu Pb-free Solder Joint by Complex Vibration for Application of Automobile Electric Module
Young-Ho Ko, Jung-Hwan Bang, Jeong-Han Kim, Chang-Woo Lee
J Weld Join. 2013;31(1):6-10.   Published online June 4, 2013
2031626
Joint Reliability of Sn3.5Ag, Sn0.7Cu and Sn5.0Sb Pb-free Solder and Hybrids Joining Process for Application of Automobile Electric Module
Myong-Suk Kang, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2012;30(6):1-5.   Published online December 23, 2012
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Precise Joining Technology on Flexible Substrate by Using Micro-bumps
Min-Su Kim, Chang-Woo Lee
J Weld Join. 2012;30(5):1-3.   Published online November 30, 2012
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High Speed TSV Filling Technology by using Molten Solder and Fabrication of Composite Solder as Filler Material
Young-Ki Ko, Myung-Suk Kang, Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2012;30(3):21-25.   Published online July 18, 2012
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Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2011;29(6):65-70.   Published online January 20, 2012
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Optimizing Mutiple Quality Characteristics of Through Silicon Via(TSV) Interface and Solder Joint Interface by Numerical Analysis-based Taguchi Method
Han-Sur Bang, Hee-Seon Bang, Se-Min Park, Chang-Woo Lee
J Weld Join. 2011;29(3):35-38.   Published online July 7, 2011
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High Speed and Low Cost TSV Filling Technology by Using Molten Solder
Young-Ki Ko, Min-Kuy Han, Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2011;29(3):14-18.   Published online July 7, 2011
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Through Silicon Via Filling and Fine Pitch Joining Technology for 3D Electronic Package
Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2009;27(3):17-22.   Published online July 6, 2009
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Intermetallic Compounds Behavior at Laser Overlay Interface of Aluminum and Fe-based Powder
Namhyun Kang, Yeon-Gon Yoo, Chang-Woo Lee, Jeong-Han Kim
J Weld Join. 2007;25(3):51-56.   Published online July 19, 2007
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Necessity of Low Melting Temperature Pb-free Solder Alloy and Characteristics of Representative Alloys
Jong-Hyun Lee, Nam-Hyun Kang, Chang-Woo Lee, Jeong-Han Kim
J Weld Join. 2006;24(2):17-28.   Published online July 18, 2006
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[Research Papers] Development of Laser - Rotating Arc Hybrid Welding Process
Cheol-Hee Kim, Hyun-Byung Chae, Chang-Woo Lee, Jeong-Han Kim, Se-Hun Rhee
J Weld Join. 2006;24(1):88-92.   Published online April 3, 2006
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[Technical Report] Preliminary Study on Arc Sensor in Laser - Rotating Arc Hybrid Welding
Cheol-Hee Kim, Jun-Ki Kim, Nam-Hyun Kang, Chang-Woo Lee
J Weld Join. 2006;24(1):7-9.   Published online April 3, 2006
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