Author index

  • HOME
  • BROWSE ARTICLES
  • Author index
Author     
Byung-Suk Lee 2 Articles
A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee
J Weld Join. 2021;39(4):376-383.   Published online August 23, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications
Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon
J Weld Join. 2019;37(2):26-34.   Published online April 22, 2019
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

Register for e-submission  Register for e-submission
Register here to access the e-submission system of Journal of Welding and Joining for authors and reviewers.
Register for e-submission  Manuscript Submission
To submit a manuscript, please visit the Journal of Welding and Joining e-submission management system at https://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of Welding and Joining e-submission system.
For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Register for e-submission  Free archive
Anyone may access any past or current articles without logging in.


ABOUT
BROWSE ARTICLES
ARTICLE CATEGORY 
FOR CONTRIBUTORS
Editorial Office
#304, San-Jeong Building, 23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
Tel: +82-2-538-6511    Fax: +82-2-538-6510    E-mail: koweld@kwjs.or.kr                

Copyright © 2024 by The Korean Welding and Joining Society.

Developed in M2PI