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JWJ > Volume 25(2); 2007 > Article
Journal of KWJS 2007 April;25(2) :82-88.
Published online May 17, 2007.
Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints
Won-Sik Hong, Whee-Sung Kim, Noh-Chang Park, Kwang-Bae Kim



Correspondence:   Published online May 17, 2007
ABSTRACT
  Sn-3.0Ag-0.5Cu lead free solder was generally utilized in electronics assemblies. But it is insufficient to research about activation energy(Q) that is applying to evaluate the solder joint reliability of environmental friendly electronics assemblies. Therefore this study investigated Q values which are needed to IMC formation and growth of Sn-3.0Ag-0.5Cu/Cu and Sn-40Pb/Cu solder joints during aging treatment. We bonded Sn-3.0Ag-0.5Cu and Sn-40Pb solders on FR-4 PCB with Cu pad(t=80㎛). After reflow soldering, to observe the IMC formation and growth of the solder joints, test specimens were aged at 70, 150 and 170 ℃ for 1, 2, 5, 20, 60, 240, 960, 15840, 28800 and 43200 min, respectively. SEM and EDS were utilized to analysis the IMCs. From these results, we measured the total IMC(Cu?Sn?+Cu₃Sn) thickness of Sn-3.0Ag-0.5Cu/Cu and Sn-40Pb/Cu interface, and then obtained Q values for the IMC(Cu?Sn?+Cu₃Sn) growth of the solder joints.
Keywords: Activation energy;SnAgCu;Intermetallic compound;Solder joints
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