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JWJ > Volume 22(2); 2004 > Article
Journal of KWJS 2004 April;22(2) :38-45.
Published online September 15, 2004.
Evaluation of Flaws in Adhesively Bonded Joint using Ultrasonic Signal Analysis
Yeong-Taik Hwang, Seung-Kyu Oh, Jun-Young Han, Sup-Chul Jang, Song-Nam Yun, Won Yi, Hwan-Tae Kim






Correspondence:   Published online September 15, 2004
ABSTRACT
Ultrasonic signals transmitted through adhesively bonded plates were used to evaluate parameters related to attenuation and frequency in the adhesively bonded joint. The kinds of bonding materials with a different bonding thickness of constant pressure were used. And, ultrasonic diagnosis was evaluated by p-wave sensor of 10㎒. FFT has been performed to determine bond-layer parameters such as effective thickness and frequency for adhesively bonded joint of AI6061 plates in comparison with measured to theoretical ratios. When variable thickness exists, the ultrasonic spectrum was changed the frequency wave. The more materials thickness and the higher the frequency, the larger shift was observed. Measured ratios for cases of bond thickness and variety bonding materials are then used to determine bond parameters. The results show that the technique can be applied to the characterization of adhesively bonded joint.
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