Analysis on the Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering

Son, Young-Seok; Shin, Jee-Young

Journal of KWJS 2003;21(6):46-54.
Published online October 27, 2003.

[연구논문] 강제대류-적외선 리플로 솔더링시 전자조립품의 열적반응 분석

Analysis on the Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering

Abstract

The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the rellow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be lised in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.