Trends of Electronic packaging and Characteristics Evaluation by Shape of Solder Joints

신영의,; 고영욱,; 김종민,; 윤종구,

Warning: fopen(/home/virtual/kwjs/journal/upload/ip_log/ip_log_2024-04.txt): failed to open stream: Permission denied in /home/virtual/lib/view_data.php on line 88 Warning: fwrite() expects parameter 1 to be resource, boolean given in /home/virtual/lib/view_data.php on line 89 Trends of Electronic packaging and Characteristics Evaluation by Shape of Solder Joints

Journal of KWJS 2002;20(3):24-30.
Published online June 25, 2002.

전자부품 패키징 경향 및 접합부 형상과 특성평가

, , ,

Trends of Electronic packaging and Characteristics Evaluation by Shape of Solder Joints

신영의, 고영욱, 김종민, 윤종구

TOOLS

PDF Links
Full text via DOI
Download Citation
Share :

METRICS

1,520 View
0 Download

Related articles

Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint2016 February;34(1)

Development Trend of Sour Resistant Linepipe Steel and its Sour Characteristics in Welded Joints2014 October;32(5)

Evaluation of Metallurgical Characteristics and Strength on Soldered Joint2002 August;20(4)

A Study on the Characteristics Sn-Ag-X Solder Joint 2002 April;20(2)

Editorial Office: #304, San-Jeong Building, 23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
Tel: +82-2-538-6511 Fax: +82-2-538-6510 E-mail: koweld@kwjs.or.kr