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JWJ > Volume 20(3); 2002 > Article
Journal of KWJS 2002 June;20(3) :16-23.
Published online June 25, 2002.
The Growth Kinetics of Intermetallic Compound Layer in Lead-Free Solder Joints
이창배, 이창열, 서창제, 정승부



Correspondence:   Published online June 25, 2002
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