Characteristics of Sn-Pb Electroplating and Bump formation for Flip Chip Fabrication

황현,; 홍순민,; 강춘식,; 정재필,

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Journal of KWJS 2001;19(5):72-77.
Published online October 25, 2001.

전해도금에 의해 제조된 플립칩 솔더 범프의 특성

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Characteristics of Sn-Pb Electroplating and Bump formation for Flip Chip Fabrication

황현, 홍순민, 강춘식, 정재필

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