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Journal of KWJS 2001;19(3):60-65.
Published online June 25, 2001.
μBGA 패키지에서 솔더 볼의 초기 접합강도와 금 확산에 관한 연구
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A Study on the Initial Bonding Strength of Solder Ball and Au Diffusion at Micro Ball Grid Array Package
김경섭, 이석, 김헌희, 윤준호
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