A Study on the Reliability of Plastic BGA Package

김경섭,; 신영의,

TOOLS

PDF Links

Full text via DOI

Download Citation

CrossRef TDM

E-Mail

METRICS

1,145

View

Download

A Study of Brittle Crack Arrestability Test Method 2020 December;38(6)

A Study of the Effect of Magnetic Fields Using Welding Process 2014 October;32(5)

A Study on Real-time Prediction of Bead Width on GMA Welding 2007 December;25(5)

Flip-chip Bonding Technology and Reliability of Electronic Packaging 2007 April;25(2)

A Study on the Distortion of a Thin Plate Panel by Laser Welding 2007 February;25(1)

A Study of Brittle Crack Arrestability Test Method 2020 December;38(6)

A Study of the Effect of Magnetic Fields Using Welding Process 2014 October;32(5)

A Study on Real-time Prediction of Bead Width on GMA Welding 2007 December;25(5)

Flip-chip Bonding Technology and Reliability of Electronic Packaging 2007 April;25(2)

A Study on the Distortion of a Thin Plate Panel by Laser Welding 2007 February;25(1)

Register for e-submission

Manuscript Submission

To submit a manuscript, please visit the Journal of KWJS e-submission management system at http://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of KWJS e-submission system. For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.

Free archive

Anyone may access any past or current articles without logging in.