Advanced Search  
JWJ > Volume 33(5); 2015 > Article
Journal of Welding and Joining 2015 October;33(5) :41-46.
Published online October 30, 2015.
doi:https://doi.org/10.5781/JWJ.2015.33.5.41
Evaluation Method for Snap Cure Behavior of Non-conductive Paste for Flip Chip Bonding
Kyung-Eun Min*, Jun-Sik Lee**, So-Jeong Lee**, Sung Yi*, Jun-Ki Kim**,***
*Mechanical and Materials Engineering Department, Portland State University, Portland OR, USA
**Welding & Joining R&D Group/Micro-joining Center, KITECH, Incheon 21999, Korea
**,***Critical Materials & Semiconductor Packaging Engineering, KUST, Incheon 21999, Korea
Correspondence: Jun-Ki Kim  Email: jkim@kitech.re.kr
  Published online October 30, 2015
ABSTRACT
The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.
Keywords: Flip chip bonding | Flip chip adhesive | NCP(non-conductive paste) | Curing rate | DEA (dielectric analysis) | Isothermal DSC(differential scanning calorimetry)
TOOLS
PDF Links  PDF Links
Full text via DOI  Full text via DOI
Download Citation  Download Citation
CrossRef TDM  CrossRef TDM
  E-Mail
Share:      
METRICS
1
Crossref
860
View
9
Download
Related articles
Effect of Fine Silica Filler Addition on the CTE and Void Behavior of Non-conductive Paste for CoB Flip Chip Bonding  2018 August;36(4)
Evaluation Method for the Resistance to Hydrogen Induced Cracking  2004 April;22(2)
Effect of Fine Silica Filler Addition on the CTE and Void Behavior of Non-conductive Paste for CoB Flip Chip Bonding  2018 August;36(4)
Evaluation Method for the Resistance to Hydrogen Induced Cracking  2004 April;22(2)
e-sciencecentral
Register for e-submission
Register here to access the e-submission system of Journal of Welding and Joining for authors and reviewers.
Manuscript Submission
To submit a manuscript, please visit the Journal of Welding and Joining e-submission management system at http://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of Welding and Joining e-submission system. For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Free archive
Anyone may access any past or current articles without logging in.
Editorial Office
The Korea Science and Technology Building, New B/D, Room 503
Teheran-ro 7-gil, 22(635-4, Yeoksam-Dong), Gangnam-gu, Seoul 06130, Korea
TEL : +82-2-538-6511    FAX : +82-2-538-6510   E-mail: koweld@kwjs.or.kr
Browse Articles |  Current Issue |  For Authors and Reviewers |  About
Copyright© by The Korean Welding and Joining Society. All right reserved.