Advanced Search  
JWJ > Volume 31(3); 2013 > Article
Journal of KWJS 2013 June;31(3) :22-30.
Published online June 30, 2013.
doi:https://doi.org/10.5781/KWJS.2013.31.3.22
Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics
Won Sik Hong, Chul Min Oh
Components and Materials Physics Research Center, Korea Electronic Technology Institute, Seongnam 463-816, Korea
Correspondence: Won Sik Hong  Email: wshong@keti.re.kr
  Published online June 30, 2013
ABSTRACT
Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, Cr6+) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Leadfree solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.
Keywords: Automotive | Electronic control unit | Lead-free | Solder joint | Degradation | Whisker | Reliability
TOOLS
PDF Links  PDF Links
Full text via DOI  Full text via DOI
Download Citation  Download Citation
CrossRef TDM  CrossRef TDM
  E-Mail
Share:      
METRICS
4
Crossref
1,310
View
14
Download
Related articles
Validation of sequence test method of Pb-free solder joint for automotive electronics  2015 June;33(3)
Degradation Characteristics of Eutectic and Pb-free Solder Joint of Electronics mounted for Automotive Engine  2014 June;32(3)
Verification Guideline of Pb-free Solder Joint Reliability for Military Electronics  2012 June;30(3)
Trend of Joining Technology for Automotive Sheet Steels  2009 April;27(2)
Validation of sequence test method of Pb-free solder joint for automotive electronics  2015 June;33(3)
Degradation Characteristics of Eutectic and Pb-free Solder Joint of Electronics mounted for Automotive Engine  2014 June;32(3)
Verification Guideline of Pb-free Solder Joint Reliability for Military Electronics  2012 June;30(3)
Trend of Joining Technology for Automotive Sheet Steels  2009 April;27(2)
e-sciencecentral
Register for e-submission
Register here to access the e-submission system of Journal of KWJS for authors and reviewers.
Manuscript Submission
To submit a manuscript, please visit the Journal of KWJS e-submission management system at http://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of KWJS e-submission system. For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Free archive
Anyone may access any past or current articles without logging in.
Editorial Office
The Korea Science and Technology Building, New B/D, Room 503
Teheran-ro 7-gil, 22(635-4, Yeoksam-Dong), Gangnam-gu, Seoul 06130, Korea
TEL : +82-2-538-6511    FAX : +82-2-538-6510   E-mail: koweld@kwjs.or.kr
Browse Articles |  Current Issue |  For Authors and Reviewers |  About
Copyright© by The Korean Welding and Joining Society. All right reserved.