Study on the Mechanical Properties and Thermal Conductive Properties of Cu/STS/Cu Clad Metal for LED/semiconductor Package Device Lead Frame

Lee, Chang-Hun; Kim, Ki-Chul; Kim, Young-Sung

doi:2012.30.3.32

J Weld Join > Volume 30(3); 2012 > Article

Journal of KWJS 2012;30(3):32-37.
DOI: https://doi.org/10.5781/KWJS.2012.30.3.32 Published online July 18, 2012.

LED 및 반도체 소자 리드프레임 패키징용 Cu/STS/Cu 클래드메탈의 기계적/열전도/전기적 특성연구

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Study on the Mechanical Properties and Thermal Conductive Properties of Cu/STS/Cu Clad Metal for LED/semiconductor Package Device Lead Frame

Chang-Hun Lee, Ki-Chul Kim, Young-Sung Kim

Abstract

  Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m·K and 52.78 ㎏/㎟, respectively.

Key Words: Clad metal, Lead frame, LED, Semiconductor