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JWJ > Volume 29(5); 2011 > Article
Journal of KWJS 2011 October;29(5) :95-98.
Published online November 22, 2011.
Flux residue effect on the electrochemical migration of Sn-3.0Ag-0.5Cu
Junghwan. Bang, Changwoo. Lee

Correspondence:   Published online November 22, 2011
ABSTRACT
  Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, 85 ℃, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.
Keywords: Pb-free solder;Electrochemical migration;ion migration;High temperature solders
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