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Journal of KWJS 2011;29(3):35-38.
Published online July 7, 2011.
Taguchi 실험계획법 기반 수치해석을 이용한 TSV계면과 솔더 접합부의 최적화
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Optimizing Mutiple Quality Characteristics of Through Silicon Via(TSV) Interface and Solder Joint Interface by Numerical Analysis-based Taguchi Method
Han-Sur Bang, Hee-Seon Bang, Se-Min Park, Chang-Woo Lee
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