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Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
Sujong Kim, Wonsik Hong, Hyunbin Nam, Namhyun Kang
JWJ. 2021;39(1):89-102.   Published online 2021 February 26    DOI: https://doi.org/10.5781/JWJ.2021.39.1.11

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Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
Journal of Welding and Joining. 2021;39(1):89-102   Crossref logo
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Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints
Journal of Materials Research. 2011;26(8):983-991   Crossref logo
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Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling
Journal of Electronic Materials. 2014;44(1):590-596   Crossref logo
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Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints
Journal of Materials Science. 2010;45(4):929-935   Crossref logo
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Interfacial intermetallic growth and shear strength of lead-free composite solder joints
Journal of Alloys and Compounds. 2009;473(1-2):100-106   Crossref logo
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Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints
Journal of Materials Research. 2008;23(10):2591-2596   Crossref logo
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Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints
Journal of Materials Science: Materials in Electronics. 2015;26(5):2674-2681   Crossref logo
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Electromigration-induced Bi-rich whisker growth in Cu/Sn–58Bi/Cu solder joints
Journal of Materials Science. 2010;45(2):334-340   Crossref logo
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Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading
Acta Materialia. 2008;56(2):242-249   Crossref logo
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Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints
Acta Materialia. 2009;57(8):2560-2566   Crossref logo
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