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Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors
Sunghyun Sohn, Daewon Kim, Hongpyo Kim, Namhyun Kang
JWJ. 2020;38(2):158-165.   Published online 2020 April 29    DOI: https://doi.org/10.5781/JWJ.2020.38.2.5

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Correction to: Transient Liquid Phase Bonding
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging. 2019;C1-C1   Crossref logo
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Transient Liquid Phase Bonding
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging. 2019;197-249   Crossref logo
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Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging
Journal of Materials Science: Materials in Electronics. 2017;28(11):7827-7833   Crossref logo
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Transient Liquid Phase Bonding
CIRP Encyclopedia of Production Engineering. 2019;1752-1752   Crossref logo
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Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach
Applied Sciences. 2019;9(17):3476   Crossref logo
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Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors
Materials. 2018;11(12):2531   Crossref logo
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Silver Die Attach Bonding
CIRP Encyclopedia of Production Engineering. 2019;1565-1565   Crossref logo
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Transient liquid phase bonding of Inconel 617 superalloy: effect of filler metal type and bonding time
Welding in the World. 2018;63(1):191-200   Crossref logo
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Joining of Al2O3p/Al composites by transient liquid phase (TLP) bonding and a novel process of active-transient liquid phase (A-TLP) bonding
Materials Science and Engineering: A. 2008;488(1-2):146-156   Crossref logo
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On the Extension of Processing Time with Increase in Temperature during Transient-Liquid Phase Bonding
Metallurgical and Materials Transactions A. 2009;40(2):377-385   Crossref logo
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