CrossRef Text and Data Mining
Result of CrossRef Text and Data Mining Search is the related articles with entitled article. If you click link1 or link2 you will be able to reach the full text site of selected articles; however, some links do not show the full text immediately at now. If you click CrossRef Text and Data Mining Download icon, you will be able to get whole list of articles from literature included in CrossRef Text and Data Mining.
A Study on Joint Properties of Sn-Cu-(X)Al-(Y)Si/Cu Solder by Multiple Reflow
Dong-Yurl Yu, Jun-Hyuk Son, Yong-Ho Ko, Chang-Woo Lee, Dongjin Byun, Junghwan Bang
JWJ. 2020;38(2):131-137.   Published online 2020 April 28    DOI:

Excel Download

Thermal Fatigue Behavior of Sn–Ag/Cu Solder Joints
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. 2015;119-140   Crossref logo

Intermetallic compound formation in Sn–Co–Cu, Sn–Ag–Cu and eutectic Sn–Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering
Materials Science and Engineering: B. 2006;135(2):134-140   Crossref logo
Link1 Link2

Asymmetrical solder microstructure in Ni/Sn/Cu solder joint
Scripta Materialia. 2006;55(4):347-350   Crossref logo
Link1 Link2

Phase Analysis in the Solder Joint of Sn-Cu Solder/IMCs/Cu Substrate
Materials Characterization. 1999;42(2-3):143-160   Crossref logo
Link1 Link2

Reflow profile study of the Sn‐Ag‐Cu solder
Soldering & Surface Mount Technology. 2004;16(1):27-34   Crossref logo
Link1 Link2

Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles
Transactions of the Indian Institute of Metals. 2018;71(11):2693-2698   Crossref logo
Link1 Link2 Link3

A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints
Soldering & Surface Mount Technology. 2011;23(1):40-46   Crossref logo
Link1 Link2

Optical properties and electronic structure of dilute Cu-Au, Cu-Zn, Cu-Al, Cu-Ga, Cu-Si, Cu-Ge, Cu-Sn, and Cu-As alloys
Physical Review B. 1977;16(10):4314-4323   Crossref logo
Link1 Link2

The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Scientific Reports. 2019;9(1):   Crossref logo
Link1 Link2 Link3

Void dynamics in lead-free Sn-Ag-Cu solder joints
PAMM. 2016;16(1):615-616   Crossref logo

This metadata service is kindly provided by CrossRef from May 29, 2014. Journal of Welding and Joining has participated in CrossRef Text and Data Mining service since October 29, 2014.