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A Study on Joint Properties of Sn-Cu-(X)Al-(Y)Si/Cu Solder by Multiple Reflow
Dong-Yurl Yu, Jun-Hyuk Son, Yong-Ho Ko, Chang-Woo Lee, Dongjin Byun, Junghwan Bang
JWJ. 2020;38(2):131-137.   Published online 2020 April 28    DOI: https://doi.org/10.5781/JWJ.2020.38.2.1

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Thermal Fatigue Behavior of Sn–Ag/Cu Solder Joints
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. 2015;119-140   Crossref logo
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Intermetallic compound formation in Sn–Co–Cu, Sn–Ag–Cu and eutectic Sn–Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering
Materials Science and Engineering: B. 2006;135(2):134-140   Crossref logo
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Asymmetrical solder microstructure in Ni/Sn/Cu solder joint
Scripta Materialia. 2006;55(4):347-350   Crossref logo
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Phase Analysis in the Solder Joint of Sn-Cu Solder/IMCs/Cu Substrate
Materials Characterization. 1999;42(2-3):143-160   Crossref logo
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Reflow profile study of the Sn‐Ag‐Cu solder
Soldering & Surface Mount Technology. 2004;16(1):27-34   Crossref logo
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Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles
Transactions of the Indian Institute of Metals. 2018;71(11):2693-2698   Crossref logo
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A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints
Soldering & Surface Mount Technology. 2011;23(1):40-46   Crossref logo
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Optical properties and electronic structure of dilute Cu-Au, Cu-Zn, Cu-Al, Cu-Ga, Cu-Si, Cu-Ge, Cu-Sn, and Cu-As alloys
Physical Review B. 1977;16(10):4314-4323   Crossref logo
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The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Scientific Reports. 2019;9(1):   Crossref logo
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Void dynamics in lead-free Sn-Ag-Cu solder joints
PAMM. 2016;16(1):615-616   Crossref logo
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This metadata service is kindly provided by CrossRef from May 29, 2014. Journal of Welding and Joining has participated in CrossRef Text and Data Mining service since October 29, 2014.