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Effect of Underfill and Cornerfill on the 3-Point Bending Reliability of BGA Package Under Thermal Shock Test
Kyung-Yeol Kim, Haksan Jeong, Sang-Woo Kim, Jae-Oh Bang, Seung-Boo Jung
JWJ. 2020;38(2):145-151.   Published online 2020 April 22    DOI:

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