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Chip Sinter-Bonding Using Ag-Based Paste for Power Semiconductor Devices
Na Yeon Lee, Jong-Hyun Lee, Chang-Yong Hyun
JWJ. 2019;37(5):482-492.   Published online 2019 October 4    DOI: https://doi.org/10.5781/JWJ.2019.37.5.8

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Chip Sinter-Bonding Using Ag-Based Paste for Power Semiconductor Devices
Journal of Welding and Joining. 2019;37(5):482-492   Crossref logo
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Sinter bonding of inkjet-printed Ag die-attach as an alternative to Ag paste
Journal of Materials Science: Materials in Electronics. 2018;29(13):11421-11428   Crossref logo
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Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors
Journal of Materials Science: Materials in Electronics. 2018;29(17):15223-15232   Crossref logo
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Recent IC assembly technology and reliability Ag paste glue die bonding
Microelectronics Reliability. 1987;27(2):386   Crossref logo
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Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles
Archives of Metallurgy and Materials. 2017;62(2):1143-1148   Crossref logo
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Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste
Japanese Journal of Applied Physics. 2019;58(SB):SBBD15   Crossref logo
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GaN- and SiC-Based Power Devices
Comprehensive Semiconductor Science and Technology. 2011;299-339   Crossref logo
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Microscale Ag particle paste for sintered joints in high-power devices
Materials Letters. 2015;161:231-233   Crossref logo
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Gate drivers for wide bandgap power devices
Wide Bandgap Semiconductor Power Devices. 2019;249-300   Crossref logo
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Wide Bandgap Semiconductor Power Devices. 2019;iv   Crossref logo
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