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Investigations of Material Properties of Underfill Material for Mechanical Reliability Improvement of Electronic Devices
Byung-Seung Yim, Jin-Nam Kim, Jong-Min Kim
JWJ. 2019;37(5):477-481.   Published online 2019 September 19    DOI: https://doi.org/10.5781/JWJ.2019.37.5.7

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Investigations of Material Properties of Underfill Material for Mechanical Reliability Improvement of Electronic Devices
Journal of Welding and Joining. 2019;37(5):477-481   Crossref logo
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