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Process Optimization for Femtosecond Laser Hole Drilling of Silicon Wafer
Hyeongwon Kim, Hyungson Ki
JWJ. 2019;37(3):220-225.   Published online 2019 June 26    DOI: https://doi.org/10.5781/JWJ.2019.37.3.4

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Process Optimization for Femtosecond Laser Hole Drilling of Silicon Wafer
Journal of Welding and Joining. 2019;37(3):220-225   Crossref logo
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Analysis of the Laser Drilling Process for the Combination with a Single-Lip Deep Hole Drilling Process with Small Diameters
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Femtosecond laser deep hole drilling of silicate glasses in air
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Fabrication of through-wafer 3D microfluidics in silicon carbide using femtosecond laser
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Silicon wafer surface patterning using femtosecond laser irradiation below ablation threshold
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Removal of nanoparticles from a silicon wafer using plasma shockwaves excited with a femtosecond laser
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