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Process Optimization for Femtosecond Laser Hole Drilling of Silicon Wafer
Hyeongwon Kim, Hyungson Ki
JWJ. 2019;37(3):220-225.   Published online 2019 June 26    DOI:

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Process Optimization for Femtosecond Laser Hole Drilling of Silicon Wafer
Journal of Welding and Joining. 2019;37(3):220-225   Crossref logo
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Fabrication of through-wafer 3D microfluidics in silicon carbide using femtosecond laser
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