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Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications
Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
JWJ. 2019;37(2):7-14.   Published online 2019 April 30    DOI: https://doi.org/10.5781/JWJ.2019.37.2.2

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Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications
Journal of Welding and Joining. 2019;37(2):7-14   Crossref logo
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The microelectronics applications of differential scanning calorimetry for packaging and materials—Including solder pastes
Microelectronics Reliability. 1985;25(1):9-16   Crossref logo
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Technology of electronic grade solder pastes
Microelectronics Reliability. 1982;22(6):1191   Crossref logo
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Technology of electronic grade solder pastes
Microelectronics Journal. 1984;15(2):75-76   Crossref logo
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Humidity effects on adhesion strength between solder ball and epoxy underfills
Polymer. 1997;38(15):3811-3818   Crossref logo
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Advanced Bonding Technology Based on Nano- and Micro-metal Pastes
Materials for Advanced Packaging. 2016;589-626   Crossref logo
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Rheological characterization of solder pastes
Journal of Electronic Materials. 1994;23(6):525-532   Crossref logo
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Solder balling of lead-free solder pastes
Journal of Electronic Materials. 2002;31(11):1130-1138   Crossref logo
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Screen printable epoxy/BaTiO3embedded capacitor pastes with high dielectric constant for organic substrate applications
Journal of Applied Polymer Science. 2008;110(2):798-807   Crossref logo
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2,6-Dibromo-3,5-dimethyl-4-hydroxybenzyl ether and epoxy systems
Polymer Bulletin. 1991;25(2):279-286   Crossref logo
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