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Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications
Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon
JWJ. 2019;37(2):26-34.   Published online 2019 April 22    DOI: https://doi.org/10.5781/JWJ.2019.37.2.5

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Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications
Journal of Welding and Joining. 2019;37(2):26-34   Crossref logo
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Effect of Sintering Conditions on the Mechanical Strength of Cu-Sintered Joints for High-Power Applications
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