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Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
JWJ. 2019;37(1):76-81.   Published online 2019 January 24    DOI: https://doi.org/10.5781/JWJ.2019.37.1.10

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Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers
Journal of Welding and Joining. 2019;37(1):76-81   Crossref logo
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Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers
Journal of Materials Science: Materials in Electronics. 2015;27(1):982-991   Crossref logo
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Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy fillers
Journal of Materials Science: Materials in Electronics. 2016;27(6):6223-6231   Crossref logo
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Journal of Applied Polymer Science. 2000;77(4):756-763   Crossref logo
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Novel low melting point alloy‐loaded polymer composite. II. Resistivity–temperature behavior
Journal of Applied Polymer Science. 2000;77(4):756-763   Crossref logo
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Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers
Journal of Composite Materials. 2012;47(9):1141-1152   Crossref logo
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Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler
Microelectronics Reliability. 2010;50(2):258-265   Crossref logo
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794. Low melting-point alloy with a bismuth base
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A novel low-melting-point alloy-loaded polymer composite. I. Effect of processing temperature on the electrical properties and morphology
Journal of Applied Polymer Science. 2000;77(5):1044-1050   Crossref logo
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A novel low‐melting‐point alloy‐loaded polymer composite. I. Effect of processing temperature on the electrical properties and morphology
Journal of Applied Polymer Science. 2000;77(5):1044-1050   Crossref logo
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