CrossRef Text and Data Mining
Result of CrossRef Text and Data Mining Search is the related articles with entitled article. If you click link1 or link2 you will be able to reach the full text site of selected articles; however, some links do not show the full text immediately at now. If you click CrossRef Text and Data Mining Download icon, you will be able to get whole list of articles from literature included in CrossRef Text and Data Mining.
Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
JWJ. 2018;36(5):52-60.   Published online 2018 September 17    DOI: https://doi.org/10.5781/JWJ.2018.36.5.7

Excel Download

Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints
Journal of Welding and Joining. 2018;36(5):52-60   Crossref logo
Link1 Link2 Link3

Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn–3Cu/Cu single crystal joints
Microelectronic Engineering. 2010;87(4):601-609   Crossref logo
Link1 Link2

Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints
Journal of Alloys and Compounds. 2015;627:276-280   Crossref logo
Link1 Link2

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
Materials. 2017;10(8):920   Crossref logo
Link1

Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint
Journal of Welding and Joining. 2017;35(3):1-6   Crossref logo
Link1 Link2 Link3

Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn–3Cu/Cu joints
Scripta Materialia. 2012;67(7-8):637-640   Crossref logo
Link1 Link2

Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints
Journal of Materials Science & Technology. 2015;31(3):252-256   Crossref logo
Link1 Link2

High temperature reliability and interfacial reaction of eutectic Sn–0.7Cu/Ni solder joints during isothermal aging
Microelectronics Reliability. 2006;46(5-6):905-914   Crossref logo
Link1 Link2

Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging
Microelectronics Reliability. 2007;47(12):2169-2178   Crossref logo
Link1 Link2

Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder
Thin Solid Films. 2004;462-463:413-418   Crossref logo
Link1 Link2

This metadata service is kindly provided by CrossRef from May 29, 2014. Journal of Welding and Joining has participated in CrossRef Text and Data Mining service since October 29, 2014.