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Effect of Fine Silica Filler Addition on the CTE and Void Behavior of Non-conductive Paste for CoB Flip Chip Bonding
Da-Eun Lim, Da-Hoon Jung, So-Jung Lee, Tae-Young Lee, Se-Hoon Yoo, Young-Bae Park, Jun-Ki Kim
JWJ. 2018;36(4):83-88.   Published online 2018 August 6    DOI: https://doi.org/10.5781/JWJ.2018.36.4.10

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Effect of Fine Silica Filler Addition on the CTE and Void Behavior of Non-conductive Paste for CoB Flip Chip Bonding
Journal of Welding and Joining. 2018;36(4):83-88   Crossref logo
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Conductivity of conductive polymer for flip chip bonding and BGA socket
Microelectronics Journal. 2001;32(3):197-203   Crossref logo
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Reliability of assembly of chips and flex substrates using thermosonic flip-chip bonding process with a non-conductive paste
Microelectronic Engineering. 2010;87(11):2146-2157   Crossref logo
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Reliability of an ultra-fine-pitch COF flip-chip package using non-conductive paste
Electronic Materials Letters. 2016;12(1):48-53   Crossref logo
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Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs
Microelectronics Reliability. 2008;48(4):645-651   Crossref logo
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Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application
Microelectronics Reliability. 2008;48(2):293-299   Crossref logo
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A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages
Microelectronics Reliability. 2012;52(6):1174-1181   Crossref logo
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Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages
Microelectronics Reliability. 2004;44(2):295-302   Crossref logo
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Siemens introduces direct die feeder technology for fast, easy placement in chip on board (COB) and flip chip applications
Microelectronics International. 1999;16(3):   Crossref logo
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Low expansivity organic substrate for flip-chip bonding
Microelectronics Reliability. 1978;18(5):409   Crossref logo
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