CrossRef Text and Data Mining
Result of CrossRef Text and Data Mining Search is the related articles with entitled article. If you click link1 or link2 you will be able to reach the full text site of selected articles; however, some links do not show the full text immediately at now. If you click CrossRef Text and Data Mining Download icon, you will be able to get whole list of articles from literature included in CrossRef Text and Data Mining.
Ultrasonic Bonding Property of Aluminum Wire for Power Conversion Module of Automotive
Ji-Yeon Park, Chulmin Oh, Deok-Hee Won, Won Sik Hong
JWJ. 2018;36(3):57-64.   Published online 2018 June 12    DOI: https://doi.org/10.5781/JWJ.2018.36.3.9

Excel Download

Ultrasonic Bonding Property of Aluminum Wire for Power Conversion Module of Automotive
Journal of Welding and Joining. 2018;36(3):57-64   Crossref logo
Link1 Link2 Link3

The ultrasonic welding mechanism as applied to aluminum- and gold-wire bonding in microelectronics
Microelectronics Reliability. 1978;17(6):563   Crossref logo
Link1 Link2

Variables affecting weld quality in ultrasonic aluminum wire bonding
Microelectronics Reliability. 1970;9(4):318   Crossref logo
Link1 Link2

Alloy element additions to gold thick film conductors: effects on indium/lead soldering and ultrasonic aluminum wire bonding
Microelectronics Reliability. 1978;17(4):426-427   Crossref logo
Link1 Link2

Alloy element additions to gold thick film conductors: Effects on indium/lead soldering and ultrasonic aluminum wire bonding
Microelectronics Reliability. 1978;17(5):493   Crossref logo
Link1 Link2

Room temperature wedge–wedge ultrasonic bonding using aluminum coated copper wire
Microelectronics Reliability. 2011;51(1):97-106   Crossref logo
Link1 Link2

High reliability aluminum wire bonding
Microelectronics Reliability. 1970;9(2):110-111   Crossref logo
Link1 Link2

Ball formation processes in aluminum bonding wire
Microelectronics Reliability. 1987;27(1):187   Crossref logo
Link1 Link2

Aluminum ultrasonic joining in spider and wire connections
Microelectronics Reliability. 1972;11(1):20   Crossref logo
Link1 Link2

A finite element analysis of effects of ultrasonic welding parameters on the temperature distribution in wire bonding
PAMM. 2016;16(1):375-376   Crossref logo
Link1

This metadata service is kindly provided by CrossRef from May 29, 2014. Journal of Welding and Joining has participated in CrossRef Text and Data Mining service since October 29, 2014.