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Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions
Dong-Yurl Yu, Junhyuk Son, Yong-Ho Ko, Chang-Woo Lee, Junghwan Bang
JWJ. 2018;36(2):21-27.   Published online 2018 April 30    DOI: https://doi.org/10.5781/JWJ.2018.36.2.4

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Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions
Journal of Welding and Joining. 2018;36(2):21-27   Crossref logo
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Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint
Journal of Alloys and Compounds. 2017;728:992-1001   Crossref logo
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Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging
Intermetallics. 2012;26:11-17   Crossref logo
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Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering
Journal of Alloys and Compounds. 2011;509(5):2326-2333   Crossref logo
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Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints
Materials Letters. 2012;86:157-160   Crossref logo
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Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface
Materials Letters. 2003;57(22-23):3361-3365   Crossref logo
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Thermal Fatigue Behavior of Sn–Ag/Cu Solder Joints
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. 2015;119-140   Crossref logo
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Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu
Scripta Materialia. 2011;65(10):907-910   Crossref logo
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Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows
Metallurgical and Materials Transactions A. 2016;47(12):6526-6541   Crossref logo
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Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints
Journal of Alloys and Compounds. 2015;649:1053-1059   Crossref logo
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