PublisherDOIYearVolumeIssuePageTitleAuthor(s)Link
Journal of Welding and Joining10.5781/jwj.2018.36.2.3201836214-20Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB SubstrateKyung-Yeol Kim, Haksan Jeong, Woo-Ram Myung, Seung-Boo Junghttp://e-jwj.org/upload/jwj-36-2-14.pdf, http://e-jwj.org/journal/view.php?doi=10.5781/JWJ.2018.36.2.3, http://e-jwj.org/upload/jwj-36-2-14.pdf
Journal of Alloys and Compounds10.1016/j.jallcom.2018.10.0282019775581-588Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCBJungsoo Kim, Kwang-Ho Jung, Jae-Ha Kim, Choong-Jae Lee, Seung-Boo Junghttps://api.elsevier.com/content/article/PII:S0925838818336946?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0925838818336946?httpAccept=text/plain
Journal of Electronic Materials10.1007/s11664-016-4517-220164573651-3658Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity TestWoo-Ram Myung, Yongil Kim, Kyung-Yeol Kim, Seung-Boo Junghttp://link.springer.com/content/pdf/10.1007/s11664-016-4517-2.pdf, http://link.springer.com/article/10.1007/s11664-016-4517-2/fulltext.html, http://link.springer.com/content/pdf/10.1007/s11664-016-4517-2
Journal of Alloys and Compounds10.1016/j.jallcom.2007.05.02920084591-2225-231Interfacial microstructures and solder joint strengths of the Sn–8Zn–3Bi and Sn-9Zn–lAl Pb–free solder pastes on OSP finished printed circuit boardsChing-Tsung Lin, Chi-Shiung Hsi, Moo-Chin Wang, Tao-Chih Chang, Ming-Kann Lianghttps://api.elsevier.com/content/article/PII:S0925838807012005?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0925838807012005?httpAccept=text/plain
Microelectronics Reliability10.1016/j.microrel.2008.07.06520084811-121864-1874Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder jointJeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Junghttps://api.elsevier.com/content/article/PII:S0026271408002746?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0026271408002746?httpAccept=text/plain
Soldering & Surface Mount Technology10.1108/ssmt-05-2017-00142017294225-234Effect of fluxes on Sn-Zn-Bi solder alloys on copper substrateErvina Efzan Mhd Noor, Ayodeji Samson Ogundipehttp://www.emeraldinsight.com/doi/full-xml/10.1108/SSMT-05-2017-0014, http://www.emeraldinsight.com/doi/full/10.1108/SSMT-05-2017-0014
Journal of Alloys and Compounds10.1016/j.jallcom.2014.01.0782014615S411-S417Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finishWoo-Ram Myung, Yongil Kim, Seung-Boo Junghttps://api.elsevier.com/content/article/PII:S0925838814001091?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0925838814001091?httpAccept=text/plain
Journal of Electronic Materials10.1007/s11664-016-4803-z201645115895-5903Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCBJungsoo Kim, Woo-Ram Myung, Seung-Boo Junghttp://link.springer.com/content/pdf/10.1007/s11664-016-4803-z.pdf, http://link.springer.com/article/10.1007/s11664-016-4803-z/fulltext.html, http://link.springer.com/content/pdf/10.1007/s11664-016-4803-z.pdf
Materials Chemistry and Physics10.1016/j.matchemphys.2016.12.013201718976-79The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder jointCollin Fleshman, Wei-Yu Chen, Tzu-Ting Chou, Jia-Hong Huang, Jenq-Gong Duhhttps://api.elsevier.com/content/article/PII:S0254058416309142?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0254058416309142?httpAccept=text/plain
Applied Surface Science10.1016/j.apsusc.2016.10.0392017393496-503Photocatalytic activity of Bi 2 WO 6 /Bi 2 S 3 heterojunctions: the facilitation of exposed facets of Bi 2 WO 6 substrateLong Yan, Yufei Wang, Huidong Shen, Yu Zhang, Jian Li, Danjun Wanghttps://api.elsevier.com/content/article/PII:S0169433216321353?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0169433216321353?httpAccept=text/plain