CrossRef Text and Data Mining
Result of CrossRef Text and Data Mining Search is the related articles with entitled article. If you click link1 or link2 you will be able to reach the full text site of selected articles; however, some links do not show the full text immediately at now. If you click CrossRef Text and Data Mining Download icon, you will be able to get whole list of articles from literature included in CrossRef Text and Data Mining.
Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate
Kyung-Yeol Kim, Haksan Jeong, Woo-Ram Myung, Seung-Boo Jung
JWJ. 2018;36(2):14-20.   Published online 2018 April 30    DOI: https://doi.org/10.5781/JWJ.2018.36.2.3

Excel Download

Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate
Journal of Welding and Joining. 2018;36(2):14-20   Crossref logo
Link1 Link2 Link3

Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB
Journal of Alloys and Compounds. 2019;775:581-588   Crossref logo
Link1 Link2

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test
Journal of Electronic Materials. 2016;45(7):3651-3658   Crossref logo
Link1 Link2 Link3

Interfacial microstructures and solder joint strengths of the Sn–8Zn–3Bi and Sn-9Zn–lAl Pb–free solder pastes on OSP finished printed circuit boards
Journal of Alloys and Compounds. 2008;459(1-2):225-231   Crossref logo
Link1 Link2

Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint
Microelectronics Reliability. 2008;48(11-12):1864-1874   Crossref logo
Link1 Link2

Effect of fluxes on Sn-Zn-Bi solder alloys on copper substrate
Soldering & Surface Mount Technology. 2017;29(4):225-234   Crossref logo
Link1 Link2

Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finish
Journal of Alloys and Compounds. 2014;615:S411-S417   Crossref logo
Link1 Link2

Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB
Journal of Electronic Materials. 2016;45(11):5895-5903   Crossref logo
Link1 Link2 Link3

The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint
Materials Chemistry and Physics. 2017;189:76-79   Crossref logo
Link1 Link2

Photocatalytic activity of Bi 2 WO 6 /Bi 2 S 3 heterojunctions: the facilitation of exposed facets of Bi 2 WO 6 substrate
Applied Surface Science. 2017;393:496-503   Crossref logo
Link1 Link2

This metadata service is kindly provided by CrossRef from May 29, 2014. Journal of Welding and Joining has participated in CrossRef Text and Data Mining service since October 29, 2014.