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Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
JWJ. 2017;35(6):51-58.   Published online 2017 December 4    DOI: https://doi.org/10.5781/JWJ.2017.35.6.8

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Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint
Journal of Welding and Joining. 2017;35(6):51-58   Crossref logo
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Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder
Thin Solid Films. 2004;462-463:413-418   Crossref logo
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Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications
Microelectronics Reliability. 2017;71:119-125   Crossref logo
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Interfacial reactions on electrolytic Ni and electroless Ni(P) metallization with Sn–In–Ag–Cu solder
Journal of Alloys and Compounds. 2005;393(1-2):135-140   Crossref logo
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Investigation of interfacial reactions between Sn–Zn solder with electrolytic Ni and electroless Ni(P) metallization
Journal of Alloys and Compounds. 2007;440(1-2):117-121   Crossref logo
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Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni–P/Sn–3.5Ag solder joint
Materials Science and Engineering: A. 2006;423(1-2):175-179   Crossref logo
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Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate
Thin Solid Films. 2006;504(1-2):410-415   Crossref logo
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Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint
Journal of Welding and Joining. 2017;35(3):1-6   Crossref logo
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Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn–3.0Ag–0.5Cu solder and Ni–P UBM
Materials Science and Engineering: B. 2005;121(3):204-210   Crossref logo
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Materials interaction in PbSn/NiP/Al and PbSn/NiB/Al solder bumps on chips
Thin Solid Films. 1993;229(1):63-75   Crossref logo
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