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Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
JWJ. 2017;35(5):38-47.   Published online 2017 September 26    DOI:

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Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module
Journal of Welding and Joining. 2017;35(5):38-47   Crossref logo
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Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging
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Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging
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Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding
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Aging treatment characteristics of solder bump joint for high reliability optical module
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Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications
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Power cycling thermal fatigue of Sn–Pb solder joints on a chip scale package
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Impact strength of Sn–3.0Ag–0.5Cu solder bumps during isothermal aging
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